Tg170 FR4 HASL Heavy Copper PCB For Plane Transformer
Brand :Multech
Product origin :China
Delivery time :7-9days
Supply capacity :88000sqm/month
Tg170 FR4 HASL heavy copper PCB for plane transformer
2.0mm thickness
FR4 TG170
4/4mil line width/space
ENIG(1U”)
2oz finished
100% AOI Test
ISO.9001/CQC/ISO.TS16949/ROHS
Application:Consumer/home/network
1)Specs For Rigid pcb:
Specifications | Standard Technology | Advanced Technology |
Number of Layers | 1 - 12 | 14 - 40 |
Board Material | FR-4 (Tg-135C, 145C, 170C), Halogen- free Rogers Ultralam 2000, Rogers RO4350, Rogers RO4003 Polyimide Black FR-4 Arlon AR-350 Getek Copper Clad Thermal Substrates (Rogers and FR4) BT Epoxy Nelco 4013 PTFE Metal Core Materials Aluminum Core | |
Minimum Board Thickness | 2 layer - 0.010" 4 layer - 0.020" 6 layer - 0.020" 8 layer - 0.062" 10 layer - 0.062" 12 layer - 0.062" | 2 layer - 0.005" 4 layer - 0.010" 6 layer - 0.031" 8 layer - 0.040"
|
Maximum Board Thickness | 2 layer - 0.125" 3-12 layer - 0.200" | 0.250" - 0.500" |
Copper Thickness | 0.5 oz - 3 oz | 4 oz - 6 oz |
Hole Aspect Ratio | 7 : 1 | 15 : 1 |
Minimum Hole Size | 0.008" | 0.006" |
Minimum Trace/Space | 0.006"/0.006" | 0.003"/0.003" |
Minimum Drill-to-Copper | 0.010" | 0.003" |
Minimum Pitch | 1 mm | 0.3 mm |
Surface Finish | HASL (Solder) Lead Free Solder Copper Gold Gold Fingers White Tin OSP | HASL Gold (ENIG/Hard/Soft) ENEPIG Selective Gold Immersion Silver OSP White Tin |
Solder Mask | Green/Black/Red/Blue/Yellow/White/Clear | Orange/Mix-and-match |
Silk Screen | White/Black/Yellow | Green/Red/Blue |
Quality Standards | IPC 6012 Class 2 Electrical Testing 100% Netlist Testing TDR Testing ISO9001 | TS16949 |
2) Specs for Flex pcb:
Item | Description | |
Layer | Flex board: 1-6Layers | |
Material | PI, PET, PEN, FR-4 | |
Final Thickness | Flex board: 0.002" - 0.1" (0.05-2.5mm) | |
Surface Treatment | Lead-free: ENG Gold; OSP, Immersion silver, Immersion Tin | |
Max / Min Board Size | Min: 0.2"x0.3" Max: 20.5"x13" | |
Min Trace | Inner: 0.5oz: 4/4mil Outer: 1/3oz-0.5oz: 4/4mil | |
Min Hole Ring | Inner: 0.5oz: 4mil Outer: 1/3oz-0.5oz: 4mil | |
Copper Thickness | 1/3oz - 2oz | |
Max / Min Insulation Thickness | 2mil/0.5mil (50um/12.7um) | |
Min Hole Size and Tolerance | Min hole: 8mil | |
Min Slot | 24mil x 35mil (0.6x0.9mm) | |
Silkscreen Line Width | 5mil | |
Gold Plating | Nickel: 100u" - 200u" | Gold: 1u"-4u" |
Immersion Nickel / Gold | Nickel: 100u" - 200u" | Gold: 1u"-5u" |
Immersion Silver | Silver: 6u" - 12u" | |
OSP | Film: 8u" - 20u" | |
Test Voltage | Testing Fixture: 50-300V | |
Profile Tolerance of Punch | Accurate mould: ±2mil | |
Ordinary mould: ±4mil | ||
Knife mould: ±8mil | ||
Hand-Cut: ±15mil |
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Download
- Multech Capability of rigid-PCB.pdf