We have been following a Continuous Improvement philosophy since the beginning. We have innovated in the following areas to keep our production cost low without compromising on quality. Automation with digital management. Most of our routine work-flows (e.g. order processing, parts tracking, labeling, shipping, etc.) are now fully automated Innovative manufacturing techniques Improved production process More efficient and higher quality machinery We believe in a win-win partnership with our customers. Our partnership will be mutually beneficial if we can provide you an edge on cost and quality.

Our high quality standard is achieved with the following. The process is strictly controlled under ISO 9001:2008 and IPC-A600/IPC-A610 standards. Extensive use of software in managing the production process State-of-art testing equipments and tools. E.g. Flying Probe, X-ray Inspection, AOI (Automated Optical Inspector) and ICT (in-circuit testing). Dedicated quality assurance team with failure case analysis process Continuous staff training and education.

This is a “v” groove cut into the top and bottom surface of an array of multiple PCB’s or between a board and rails to be removed after assembly. The cut is usually 1/3 top, 1/3 bottom, leaving 1/3 uncut in the middle. This process is used when removing the tabs of a tab route is not a viable option, this does result in a less smooth finished board edge. The boards are typically set up side by side and end to end with the edges adjacent to each other. After assembly the boards are broken or snapped apart.

Use just 1 or 2 Layer PCB for the regular boards and 4 Layer PCBs for interfaces with controlled impedance (USB, Ethernet, LVDS). If you study the component datasheet, various component manufacturers suggest a similar layout guideline pointing out to the support of minimum layers and the number of signal and ground or power layer depending on the power supply and dielectric isolation requirement.